Negotiable
The date of payment from buyers deliver within days
Guangdong
Long-term effective
2017-09-23 20:30
203
Company Profile
Guangzhou NOD Electronics Co., Ltd.By certification [File Integrity]
Contact:Mr. Rocky Long(Mr.)
Email:
Telephone:
Phone:
Area:Guangdong
Address:Guangdong
Website: http://pcb-assembly.jssytm.com/
Total Pad Size | Standard | Advanced |
Capture Pad | Drill + 0.008 | Drill + 0.006 |
Landing Pad | Drill + 0.008 | Drill + 0.006 |
BC Mechanical Drill (Type III) | 0.008 | 0.006 |
Laser Drill Size | 0.004-0.010 | 0.0025 |
Material Thickness | 0.0035 | 0.0025 |
Stacked Via | Yes | Yes |
Type I Capabilities single & Double Deep | Yes | Yes |
Type II Capabilities Buried Vias with Microvias | Yes | Yes |
Type III Capabilities | Yes | Yes |
Copper Filled Microvia | Yes | Yes |
Smallest Copper Filled Microvia | 0.004 | 0.0025 |
Copper Filled Microvia Aspect Ratio | 0.75:1 | 1:01 |
Smallest Laser Microvia Hole Size | 0.004 | 0.0025 |
Laser Via Aspect Ratio (Depth:Diameter) | 0.75:1 | 1:01 |
Turn Times | Selected Volume | Selected Solder Types |
Same day through four weeks turns | No minimum order quantity | Leaded |
Scheduled deliveries | Engineering prototypes | Lead-free/RoHS compliant |
Low cost first article builds | No-clean process available | |
Parts Procurement | Selected Stencils | Selected Ball Grid Arrays (BGA) |
Turnkey | Laser cut stainless steel | As small as .5mm pitch |
Kitted/Consigned | Nano-coating available | All BGA placements are x-ray inspected |
Partial Turnkey | ||
Assembly Types | Selected Component Types | Selected Other Capabilities |
Surface Mount (SMT) | As small as 0402 package | Pitch components as small as 15 mil |
Thru-hole | As small as 0201 with design review | Repair/Rework services |
Mixed Technology (SMT/Thru-hole) | Mechanical Assembly | |
Single or double sided placement | Box Build/Electromechanical Assembly | |
Sub-assemblies |